Laser Processing

Grooving into PET film
Grooving into PET film

We can perform non-thermal processing with short pulse, short wavelength laser for fine processing. It is also possible to accept stealth laser dicing as an application, as a microfabrication capable of depth and shape control making full use of the features of short pulse laser, making use of the features of short wavelength laser, making use of its advantages.

 

 

Please also see the page “About laser” explained about laser.

Short pulse laser

Glass cutting cross section
Glass cutting cross section

Picosecond laser, femtosecond laser etc. Thermal influence on laser material with pulse width around 10p to 800fsec is extremely small, effective for cutting and drilling of glass.

Short wavelength laser

  • A laser having a wavelength in the ultraviolet region typified by a KrF excimer laser.
  • Effective for processing requiring depth control.
  • It is also possible to perform one-shot exposure like exposure equipment.
  • V groove and taper groove can be processed by application.
  • Effective for fine grooving of resin and fine hole machining.

 

Silicon through hole machining
Silicon through hole machining
V-groove processing on polyimide
V-groove processing on polyimide

Laser processing example

Thin film removal
Thin film removal
Ni pipe cutting
Ni pipe cutting
SUS cutting and welding
SUS cutting and welding

Polyimide drilling (φ30μm)
Polyimide drilling (φ30μm)
Alumina groove processing (groove width 50μm)
Alumina groove processing (groove width 50μm)
Diagonal hole machining on silicon
Diagonal hole machining on silicon

Through hole processed into silicon (φ80μm, thickness 650 .mu.m)
Through hole processed into silicon (φ80μm, thickness 650 .mu.m)
Digging character to the hair (character width 5μm)
Digging character to the hair (character width 5μm)
Drilling into stainless steel
Drilling into stainless steel

Further processing example can be seen.

 

Here is example of laser processing.