Our standard TEG wafer (chip) specifications
We have a standard TEG wafer for evaluation such as PKG development, mounting method development, mounting & inspection equipment development, material development etc.
We can also produce TEG wafers (chips) according to customer’s application.
＊We also began offering wafer sizes φ300mm (12 inch).
Our standard TEG wafer (chip) specification
TEG-A
TEG-B
TEG-C
Cross-sectional structure (Scale to be ignored)
Our standard TEG wafer (pad・bump) specification
|
Item |
Bump specification |
Remarks |
|
TEG-□-WB |
Aluminum pad | Optional electroless Ni / Au plating process is also available. |
|
TEG-□-Cu |
Cu post (pillar) plating |
Optional solder bump plating is also supported. |
|
TEG-□-SAC-B |
Solder bump (Lead free) |
|
|
TEG-□-SAC-E |
Ni plating / solder bump plating (Lead free) |
＊A, B, C enter into □.
Shipping form
Wafer
- Until passivation formation
- Until polyimide formation
- Solder ball mounted
(including solder plated products)
Delivery form
- Wafer
- Dicing processing, tray packing
- Dicing processing, taping packing
*Board mounting is also available.Please contact us.
Other TEG
Besides WLCSP, we can also offer TEG below.
・ Comb pattern TEG for migration test.
