Polishing

Mirror processing of various materials is possible.

Back grinding is essential technology for development and manufacturing of thin package products and laminated package products.

Available size : small piece - 300mm

Back grinding of 100um or less is possible.

We also accept bumped wafers.

• Available for 2inches -12inches
• Corresponding to rectangular type substrate
• Select slurry according to application

We will perform stress-relief processing by polishing warp caused by back grinding, crushing layer caused by grinding layer which is causing insufficient strength.

• A satisfactory polishing rate cannot be obtained.
• A lot of scratches, process margin is narrow.
• Need more selective ratio.
• Dissatisfied with existing CMP slurry.

• We will develop products according to customer’s requirements, applications and processing conditions.
• We will offer a slurry that matches the object to be polished and processing process with an abundant line-up.
• We will improve or design CMP slurry for each user, and perform optimum processing.

• Residual stress does not occur because of chemical polishing different from physical polishing.
• Parts that are difficult to physically polish can also be polished.

• It is possible to size down and beveling of bare wafer and patterned wafer.
• Please contact us about wafer size. (Example : 8inches to 2 pieces of 4inches etc.)